To get an idea of the differences between the original JeeNode v6 and the new JeeNode Zero, we can first of all view them side by side:
No more through-hole parts - there are almost no µCs available anymore in the easy-to-socket Dual Inline Plastic (DIP) package. The pins of a TQFP chip are 0.8 mm apart, less than a third of the 0.1” standard breadboard grid. With a little experience it’s still quite doable to solder these by hand, but you’ll need a fine-tipped soldering iron, tweezers, flux, wick, and patience.
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